In this week’s episode of Fish Fry, we are headed to the smallest of the small process geometries: 2nm! My guest Ruben Molina (Synopsys) and I are talking about how exactly we are going to get started with these tiny process nodes and how technical advisory boards are driving the charge toward standardization and process architecture specification. Also this week, we take a closer look at the world’s first mobile skin bioprinting system unveiled by the Wake Forest Institute for Regenerative Medicine.
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Links for March 8, 2019
Industry Leaders Collaborate with Synopsys on Modeling Standards to Address Design Down to 2nm
Mobile Bedside Bioprinter Can Heal Wounds (Wake Forest School of Medicine)
Whitepaper: In Situ Bioprinting of Autologous Skin Cells Accelerates Wound Healing of Extensive Excisional Full-Thickness Wounds
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Fish Fry Executive Interviews
Anupam Bakshi, CEO – Agnisys
Dave Kleidermacher, CTO – Green Hills Software
Robert Blake, CEO – Achronix
Jack Harding, CEO – eSilicon
Michiel Ligthart, COO – Verific
Adnan Hamid, CEO – Breker Technologies
Simon Davidmann, CEO – Imperas
Ted Miracco, CEO – SmartFlow Compliance Solutions
Jessica Gomez – Rogue Valley Microdevices
Shishpal Rawat, Chairman – Accellera Systems Initiative
Kevin Bromber, CEO – myDevices
Daniel Hansson, CEO – Verifyter
Mark Papermaster, CTO – AMD
David Fried, CTO – Coventor
Dr. Steven LeBoeuf, President – Valencell
David Dutton, CEO – Silvaco
Bob Niemiec, CEO – TwistThink
Allan Martinson, COO – Starship Technologies
Zhihong Liu, Chairman and CEO – ProPlus Solutions
Taher Madraswala, CEO and President – Open-Silicon
Kapil Shankar, CEO and Director – AnDAPT
Dan Fox, CTO – Local Motors
Kim Rowe, Founder and CEO — RoweBots
Lawrence Cooke, Founder and CEO — NovaSolix
Gregg Recupero, CTO — Performance-IP
Alan Grau, CEO — Icon Labs
Carl Alberty, Vice President – Cirrus Logic
Maximilian Odendahl, CEO — Silexica
Finbarr Moynihan, General Manager — MediaTek
Sanjay Pillay, CEO — Austemper
Louis Parks, CEO – SecureRF
Harold Blomquist, CEO – Helix Semiconductor
Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire
Mike Wisart, CEO – efabless
Chris Giovanniello, SVP and Co-Founder – Menlo Micro
Jake Janovetz, President – Opal Kelly
Jerry Gipper, Executive Director – VITA
Ethan Plotkin, CEO – GDCA
Xin Song, CEO - Bottos
Chris Dries, CEO – UnitedSiC
Bob Smith, Executive Director - ESD Alliance
Rick O'Connor, Executive Director - RISC V Foundation
Naveed Sherwani, CEO and Yunsup Lee, CTO/Founder- SiFIve
Doug Letcher, CEO and President – Metrics Technologies
Jun Pei, CEO – Cepton Technologies
Nikos Zervas, CEO of CAST
Better AI Needs Better Data: How FeatureByte is Radically Simplifying the AI Data Lifecycle
SoMs, CoMs, and Cutting Edge Capabilities in Open Architecture Systems
Happy Together: Rapid Innovation with Chiplets and FPGAs
When Failure Is Not An Option: Trends in Modern Military and Aerospace Applications
How Sandbox Semiconductor is Accelerating Semiconductor Process Development
Better Tools and Faster Results: How Cadence is Redefining RTL Design
Have You Got the Spark? How SparkCharge is Changing the EV Charging Landscape
AI is My Copilot: How Flux is Revolutionizing PCB Design
Extremely Low Latency FPGAs and SmartNICs: How Achronix is Supercharging Networking Innovation
High Speed Communications, Optical Interfaces and the Future of Embedded Systems
All About Sports! Sensors, Stats and Taking Performance Analytics to the Next Level
Making Embedded Systems Smarter: How ITTIA is Tackling the Challenges of Real Time Data Management
The Freedom to Innovate: Arteris and the Rise of RISC-V
Embedded to the Future: Smaller, Faster, Denser
Let’s head to the Stars! COTs in Space 2.0 and A New AI Test for Life on Other Planets
Autonomous Driving in the Fast Lane: The Growing Need for an Architectural Redefinition of Computation Hardware
Solving a Perfect Storm of Challenges: How Multi-Die Systems Will Drive Next Generation Semiconductor Innovation
MOSA, SOSA, and NO-SA: Chassis Platforms for Military and Rugged Applications
The Next Generation of Process Engineering: How Human-Machine collaboration Will Usher In A New Era of Chip Innovation
Battlefield Ahead: How Direct RF Will Shape the Future of Electronic Warfare
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