According to Puneet Gupta, Ph.D. and his colleagues at UCLA including Subramanian Iyer, Ph.D., the printed circuit board is a constraint on electronics size and speed. And the solution is to get rid of it. The professors have developed a method to replace PCBs with an all-silicon technology, called silicon-interconnect fabric, which allows bare chips to be connected directly to wiring on a separate piece of silicon. The wiring between chips on fabric is at the nanometer scale, much like the wiring within a chip. Dr. Gupta asserts many more chip-to-chip connections are thus possible, and those connections are able to transmit data faster while using less energy. He discusses the technology and its implications with PCB Chat host Mike Buetow.
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RM 129: Network Reliability - Avoiding Cyber-Security Threats
PCB Chat 120: HDP’s Latest PCB and Solder Research
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RM 125: DFM Best Practices with Pride Industries’ Engineering Manager Andrew Williams
RM 124: Dave Hillman’s Amazing 3,600 Mile Kayak Journey Down the Missouri River
PCB Chat 119: David Schild on US Government Investment and Policy for PCB Manufacturing
PCB Chat 118: Claire Wemp, Ph.D., on Thermal Interface Materials
RM 123: Introduction to Highly Accelerated Life Testing (HALT) with Dr. Christopher Jackson
PCB Chat 117: July 2023 EDA Software Market Update
RM 122: The Integration of AI into Inspection Systems
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RM 120: Making Reliability Training Entertaining and Effective
RM 119: Quantum Mechanics Explained
PCB Chat 115: Wally Rhines on the Latest ECAD Market Data
PCB Chat 114: Matthias Wagner and Kerry Chayka of Flux
RM 118: Making ’Big Data’ Useful with Intraratio’s Ryan Gamble
RM 117: When Residues Cause Circuit Assemblies to Fail
RM 116: Supply Chain Musings with Mark Godwin of Ventec
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