According to Puneet Gupta, Ph.D. and his colleagues at UCLA including Subramanian Iyer, Ph.D., the printed circuit board is a constraint on electronics size and speed. And the solution is to get rid of it. The professors have developed a method to replace PCBs with an all-silicon technology, called silicon-interconnect fabric, which allows bare chips to be connected directly to wiring on a separate piece of silicon. The wiring between chips on fabric is at the nanometer scale, much like the wiring within a chip. Dr. Gupta asserts many more chip-to-chip connections are thus possible, and those connections are able to transmit data faster while using less energy. He discusses the technology and its implications with PCB Chat host Mike Buetow.
Concept to Creation - The Entrepreneurs of the Electronic Assembly Industry
RM65: Tim O’Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling, Part 2
RM 64: Tim O'Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling
PCB Chat 75: Keshav and Tarun Amla of Avishtech on Electronics Stackup Tools
RM Episode 63: A Conversation with Reliability Expert Dock Brown
RM Episode 62: A Conversation with Cogiscan's Co-Founder François Monette
PCB Chat 74: DuPont's Andy Kannurpatti
RM Special Edition: A Conversation with IPC Chief Technologist Matt Kelly about IPC Apex
RM 61: A Conversation with Flex Circuit and Additive Electronics Expert Tara Dunn
PCB Chat 73: AJ Incorvaia on Desktop PCB Software
RM 60: Collins' Dave Hillman about Solder Voiding
PCB Chat 72: Matt Wrosch on Transient Liquid Phase Sintering
RM Episode 59: CMOS Inventor Dr. Eric Fossom
PCB Chat 71: Is the US Ready for Smart Manufacturing?
RM 58: 2020 Round-Up
PCB Chat 70: Kent Balius on Front-End Engineering
RM 57: A Conversation with CAF Expert Graham Naisbitt
PCB Chat 69: Manny Marcano on Changes in the Mainstream PCB CAD Market
RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
RM 55 - A Conversation with SMTA President Dr. Martin Anselm
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