The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
PCB Chat Episode 50: George Milad of Uyemura
Reliability Matters: Episode Episode 32: A Conversation with Greg Smith and Tony Lentz about Stencil Design and Void Reduction
PCB Chat Episode 49: Wally Rhines/Q3 2019 EDA Market Results
Reliability Matters: Episode 30: A Conversation about Reflow Technology with David Heller
Reliability Matters Episode 28: A Conversation with IPC's Brook Sandy about IPC Apex Expo (Part 2)
Reliability Matters Episode 27: A Conversation with IPC's Brook Sandy about IPC Apex Expo (Part 1)
Reliability Matters: Episode 26 - Alun Morgan of Ventec
PCB Chat Episode 48: Dr. Puneet Gupta of UCLA
Reliability Matters: Episode 25: An Interview with Indium's Kay Parker
PCB Chat Episode 47: Hemant Shah of Cadence
Reliability Matters Episode 24: Teradyne's Mark Levin and Jon Bodin
Reliability Matters Episode 23 - A Conversation about Testing Circuit Assemblies with Datest's Robert Boguski
The Screw-Ups, Episode 4: Solder Wetting
PCB Chat Episode 46: Jeroen Leinders and Chris Hambleton of Zuken
Reliability Matters Episode 22 - A Conversation about Adhesion Testing with BTG Lab's Elizabeth Kidd
PCB Chat Episode 45: Greg Papandrew of Better Board Buying
PCB Chat Episode 44: Jack Herring of Jiva Materials
Reliability Matters Episode 21- A Conversation with Manuel Schöllig - There's More to Clean than Just Assemblies
PCB Chat Episode 43: Mike Creeden of Insulectro
Reliability Matters: Episode 20- A Conversation with Conformal Coating Expert Phil Kinner
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