The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
PCB Chat 84: Gowtham Ramachandran on the ‘Desktop Microfactory‘
C2C 9: Foresite Founder Terry Munson
RM 74: Worthington Assembly's Chris Denney on Contract Manufacturing
RM 73: Solder Paste Expert Tim Jensen of Indium
PCB Chat 83: Vincent Bedat of Volthub on OEM-EMS Data Sharing
C2C 8: STI Electronics' David Raby
RM 72: Thermal Profiling with ECD's Mark Waterman
PCB Chat 82: The RIT CEMA Capstone Project Team
PCB Chat 81: Terry Jernberg of EMA on Power Integrity
C2C 7: A Conversation with Industry Icon Bob Black
PCB Chat 80: Wally Rhines on the Latest EDA Sales Data
RM 71: Manufacturer's Reps Talk Sales and Support Post Covid-19
C2C 6: Dr. Mike Stull and Mike Konrad
RM 70: Nano Dimension Cofounder Amit Dror
PCB Chat 79: Bruce Mahler on the Ohmega-Ticer Merger
Concept to Creation 5: Datest's Robert Boguski and Regina Lathrop
PCB Chat 78: Peter Bigelow on 50 Years in PCB Fabrication
RM 69: Part 2 Mike Konrad, Chris Denney and Melissa Hough on the Pick-Place Podcast
Concept to Creation 4: Kyzen's Dr. Mike Bixenman and Tom Forsythe
PCB Chat 77: The Top 50 Electronics Manufacturing Services Companies
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