The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
RM 115: Making Sense of ’Big Data’
PCB Chat 110: Steve Robinson of APCT
RM 114: The Remarkable Return of the Post-Reflow Cleaning Process
RM 113: Counterfeit Component Detection with Dr. Eyal Weiss
Business Challenges with STI Electronics’ President David Raby
PCB Chat 109: Wally Rhines on the PCB Design Software Market
PCB Chat 108: Travis Kelly on Government Support of the US PCB Industry
RM 112: ESD Mitigation with ESD Expert Christopher Almeras
RM 111: Liquid Metal’s Potential Future in Electronics
RM 109: A Decade of Industry 4.0 - What it Was - What it Wasn’t
PCB Chat 107: Valentina Ratner and Kyle Dumont of AllSpice
PCB Chat 106: Madan Jagernauth on the Latest HDP Projects
RM 108: SMTA Pan Pacific Microelectronics Symposium Preview
RM 107: IPC Validation Services & the Trusted Supplier Program
RM 106: A Conversation about Production Automation
PCB Chat 105: Low-Heat Solders with Ian Tevis of SAFI-Tech and Andy Mackie of Indium
RM 105: Conformal Coating Material Selection Best Practices
PCB Chat 104: Wang Lu of Jove Enterprises
RM 104: Thomas Ricciardelli on ESD Flooring
PCB Chat 103: Stephen Chavez on Design Automation
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