The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
RM 149: AOI and X-Ray Best Practices
PCB Chat 134: Zachary Feuerstein on Supply Chain Management
RM 149: SMTA International 2024
RM 148: IPC Apex Special (Part 3 of 3)
PCB Chat 133: Wally Rhines on the PCB Design Software Market
PCB Chat 132: David Schild of the Printed Circuit Board Association of America
RM 146: IPC Apex Special: Soldering and Inspection
RM 145: Designing Electronics to be Reliable in Harsh Environments
PCB Chat 131: Sergiy Nesterenko on AI-Driven PCB Design
RM 143: A Candid Conversation with Doug Pauls
PCB Chat 130: Audrey McGuckin on Developing Leadership Skills
RM 142: Live from SMTA's Pan Pacific Strategic Electronics Symposium (PanPac)
RM 141: Component Tape Splicing Best Practices
PCB Chat 129: Electronics Design Market Update with Wally Rhines
RM 139: Environmentally Responsible Alternatives to Traditional PCB Fabrication
PCB Chat 127: Matthias Wagner on AI-Based PCB Design Tools
RM 138: Hand Soldering and Rework Best Practices
RM 137: Building a Sustainable Career with a Sustainable Impact
PCB Chat 127: David Schild on US Strategy for Supply Chain Readiness
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