The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
PCB Chat 126: Andrew Scheuermann on AI in Electronics
RM 136: Environmentally Responsible/Sustainable Conformal Coating
PCB Chat 125: Manny Marcano on Spinoff of Accelerated Designs
PCB Chat 124: Wally Rhines on the Latest PCB Design Software Market Data
RM 135: Zach Peterson about Board Design Best Practices
RM 134 -- 2023 Podcast Season Wrap-Up
RM 133: Novel Wireless / Wearable ESD Monitoring
PCB Chat 123: US PCB Legislation Update with David Schild of PCBAA
PCB Chat 122: Robert Feranec on PCB Design
RM 132: HZO’s Lisa Rizzo on Ultra-Thin Conformal Coating
RM 131: Industry Icon Bob Willis
PCB Chat 121: Wally Rhines on the Latest Electronics Design Software Market Data
RM 130: Human-Centered Approaches to Innovation with Dr. Alexis Abramson
RM 129: Network Reliability - Avoiding Cyber-Security Threats
PCB Chat 120: HDP’s Latest PCB and Solder Research
RM 127: Phil Zarrow and Jim Hall
RM 126: Moisture Mitigation Strategies with Dan Jenkins and Rob Lowery
RM 125: DFM Best Practices with Pride Industries’ Engineering Manager Andrew Williams
RM 124: Dave Hillman’s Amazing 3,600 Mile Kayak Journey Down the Missouri River
PCB Chat 119: David Schild on US Government Investment and Policy for PCB Manufacturing
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