The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
RM 68: Chris Denney and Melissa Hough
C2C 3: Mike Scimeca of FCT Assembly on Entrepreneurship
RM 67: Rework/Repair Expert Norman Mier of Best Inc.
C2C: Out of the Box Manufacturing Founders Allison and Chad Budvarson
PCB Chat 76: David Bernard on X-ray Inspection
RM Episode 66: Dr. Ron Lasky and Students
Concept to Creation - The Entrepreneurs of the Electronic Assembly Industry
RM65: Tim O’Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling, Part 2
RM 64: Tim O'Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling
PCB Chat 75: Keshav and Tarun Amla of Avishtech on Electronics Stackup Tools
RM Episode 63: A Conversation with Reliability Expert Dock Brown
RM Episode 62: A Conversation with Cogiscan's Co-Founder François Monette
PCB Chat 74: DuPont's Andy Kannurpatti
RM Special Edition: A Conversation with IPC Chief Technologist Matt Kelly about IPC Apex
RM 61: A Conversation with Flex Circuit and Additive Electronics Expert Tara Dunn
PCB Chat 73: AJ Incorvaia on Desktop PCB Software
RM 60: Collins' Dave Hillman about Solder Voiding
PCB Chat 72: Matt Wrosch on Transient Liquid Phase Sintering
RM Episode 59: CMOS Inventor Dr. Eric Fossom
PCB Chat 71: Is the US Ready for Smart Manufacturing?
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