The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
PCB Chat 118: Claire Wemp, Ph.D., on Thermal Interface Materials
RM 123: Introduction to Highly Accelerated Life Testing (HALT) with Dr. Christopher Jackson
PCB Chat 117: July 2023 EDA Software Market Update
RM 122: The Integration of AI into Inspection Systems
PCB Chat 116: John Watson on PCB Designer Training
RM 120: Making Reliability Training Entertaining and Effective
RM 119: Quantum Mechanics Explained
PCB Chat 115: Wally Rhines on the Latest ECAD Market Data
PCB Chat 114: Matthias Wagner and Kerry Chayka of Flux
RM 118: Making ’Big Data’ Useful with Intraratio’s Ryan Gamble
RM 117: When Residues Cause Circuit Assemblies to Fail
RM 116: Supply Chain Musings with Mark Godwin of Ventec
PCB Chat 113: David Schild of the Printed Circuit Board Association of America
PCB Chat 112: Vivek Bansal on VVDN’s Vertical Integration Model
PCB Chat 111: Metallic Resources on Reclaiming Electronics Solder
RM 115: Making Sense of ’Big Data’
PCB Chat 110: Steve Robinson of APCT
RM 114: The Remarkable Return of the Post-Reflow Cleaning Process
RM 113: Counterfeit Component Detection with Dr. Eyal Weiss
Business Challenges with STI Electronics’ President David Raby
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