The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
RM 103: SMT Assembly Equipment for Low-Volume Applications
RM 102: Contract Manufacturer Selection Process Best Practices
RM 101: The Future of US Manufacturing with IPC’s Matt Kelly
RM 100: A 100th Episode Special (Recorded Live)
PCB Chat 102: Dr. Matthew Dyson on the Factory of the Future
PCB Chat 101: Brian Morrison on Smart Manufacturing
RM 99: Graham Naisbitt on IPC Cleanliness Standard Compliance
PCB Chat 100: John Burkhert Jr. on Engineering Soft Skills
RM 98: Jen Fijalkowski on Advances in Solder Pastes
PCB Chat 99: RIT PCB Design Curriculum
RM 97: Best Practices for Purchasing X-Ray Equipment
RM 96: Phil Zarrow and Jim Hall on Their New Book
PCB Chat 98: The Cadence Allegro/ Dassault Systèmes 3DExperience Integration
PCB Chat 97: Travis Kelly on the Printed Circuit Board Association of America
RM 95: SMTA SMT Certification Course Authors Dr. Ron Lasky and Jim Hall
RM 94: Dr. Ron Lasky on His Many Books
RM 93: Dr. Kunal Shah on Ni-Less ENIG
PCB Chat 96: The Latest HDP Initiatives with Jack Fisher and Madan Jagernauth
PCB Chat 95: Latest PCB ECAD Market Data with Wally Rhines
RM 92: IPC Apex Expo Conversations: Reflow Thermal Control / Automated Device Programming
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