The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
Reliability Matters Episode 22 - A Conversation about Adhesion Testing with BTG Lab's Elizabeth Kidd
PCB Chat Episode 45: Greg Papandrew of Better Board Buying
PCB Chat Episode 44: Jack Herring of Jiva Materials
Reliability Matters Episode 21- A Conversation with Manuel Schöllig - There's More to Clean than Just Assemblies
PCB Chat Episode 43: Mike Creeden of Insulectro
Reliability Matters: Episode 20- A Conversation with Conformal Coating Expert Phil Kinner
Reliability Matters: Episode 19 - A Conversation about Display Technologies and Reliability-Improving Production Methods
PCB Chat Episode 42: Wally Rhines of Mentor on the Q1 EDA Data
PCB Chat Episode 41: Steve Pudles of Zentech
Reliability Matters: Episode 18 - A Conversation with Saturn Electronics' Yash Sutariya about PCB Fabrication
Episode 17 - A Conversation with Brian D'Amico about AOI and SPI Best Practices
PCB Chat Episode 40: Zach Dismukes of Bowman Analytics
SMT Wars: Lessons Learned from a Contract Manufacturer and Their Customer Who Sued Them
The Screw-Ups Episode 3 - Solder Paste Handling
PCB Chat Episode 39: Jim Barry of PCB Technologies
PCB Chat Episode 38: Kent McLeroth of Zuken
PCB Chat Episode 37: Kyle Miller of Zuken
Reliability Matters: Episode 14 - An Interview with Reliability Expert Fred Schenkelberg
Reliability Matters: Episode 13 - A Conversation with KIC's MB Allen About Thermal Management and Reliability
PCB Chat Episode 36: Simon Fried of Nano Dimension
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