The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
PCB Chat Episode 12 - John Mitchell and Chris Mitchell
PCB Chat Episode 11 - Mike Buetow
PCB Chat Episode 10 - Mike O'Reilly
PCB Chat Episode 9 - Randall Sherman
PCB Chat Episode 8 - Mike Buetow
PCB Chat Episode 7 - Mark Hepburn
PCB Chat Episode 6 - Wally Rhines
PCB Chat Episode 4 - Productronica Recap, Day 1
PCB Chat Episode 3 - Rick Hartley
PCB Chat Episode 2 - Joe Fama
PCB Chat Episode 1 - Mike Konrad / Aqueous Technologies
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