The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
Reliability Matters: Episode 12 - Female Leaders in Tech Everywhere
Reliability Matters: Episode 11 -- Tips & Tricks for Successfully Cleaning Circuit Assemblies
PCB Chat Episode 35: Brad Griffin on a New PCB 3-D Solver
Reliability Matters Episode 10 - An Interview with Dr. David Bernard - All About X-Ray Inspection
PCB Chat Episode 34: Leah Slaughter
Reliability Matters: Episode 9 - An Interview with Dr. Mike Bixenman about Cleaning Challenges, Chemicals, Components, and Cleanliness Testing
The Week Today - Mar. 18 - 22, 2019
Reliability Matters: Episode 8 - Cleaning Roundtable
PCB Chat: The Screw-Ups, Episode 2
Reliability Matters Episode 7 - A Conversation with ITM Consulting's Phil Zarrow and Jim Hall
PCB Chat Episode 33: Josh Ewing of Bright Machines
Reliability Matters: Doug Pauls on IPC J-STD-001G Amendment 1
The Week Today - Feb. 25 - Mar. 1, 2019
PCB Chat Episode 32: Eric Schneider
Reliability Matters: An Interview with Dr. Craig Hillman - Design for Reliability
The Week Today - Feb. 11-15, 2019
Reliability Matters: Improving Reliability of Circuit Assemblies in Harsh Environments
The Week Today - Feb. 4-8, 2019
Reliability Matters - An Interview with Johns Hopkins' APL Engineer Wendy Casker
The Week Today - Jan. 28 - Feb. 1, 2019
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